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A component s resident time in the solder wave is 10 to 30 times shorter than for a comparable solder joint formed during reflow oven soldering, so everything in wave soldering has to happen very rapidly On the other hand, heating time-temperature ramps must be observed in accordance with the component manufacturer s specifications Components and PWB bonding pads must be fluxed sufficiently to allow adequate solder-joint formation, yet there must be enough flux left on the circuit board after preheating to protect the newly fluxed surfaces until the assembly reaches the solder wave Just as in the reflow soldering oven, there are multiple solder-wave preheater styles, but only two are in prevalent use: radiant preheaters (direct and indirect IR) and forced-air convective preheaters Both are effective and both have their advantages In fact, the best configuration is a combination of the two.

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Some wave-soldering machines can be equipped with both top and bottom preheaters This can be advantageous for thermally massive boards 4744 The Wave Numerous solder-wave configurations are available Rather than provide a detailed discussion of each, this section offers a basic overview of the elements of the process in relation to the waveAs previously mentioned, the molten solder is pumped to form a standing waveThis is accomplished by a spinning impeller on the bottom or side of the solder reservoir Once the solder is molten, the impeller motor is activated and the solder wells up between baffles and nozzle that reside within the solder reservoirA combination of impeller speed and baffles-and-nozzle configuration dictates overall standing-wave characteristics The nozzles and baffles are generally adjustable, as are impeller speed, molten solder temperature, board introduction angle, and board conveyor velocity.

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These, along with preheater settings, define the profile parameters or process variables that must be tamed to accomplish high-yield wave soldering..

The response of this first-order with transport lag system for several values of A and forK = 1, r = 1, rd = 1 isgiveninFig. 18.32. ThevaluesofK,, 71, rd, and71 obtained from the above relations are shown in Table 18.2. Notice that once a model is accepted, the tuning of the modified IMC controller [Eq. (18.21)] depends only on the choice of A. For the range of A used, Fig. 18.32 shows that the step response is only slightly oscillatory for all values of A and the fastest response is for A = 0.5. Also notice that A affects only K, and ~1. This example shows that the design of a controller by the IMC method is a straightforward procedure and leads to a controller that requires the adjustment of only one parameter, A.

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Since the solder is a molten, turbulent liquid, theoretically it can make intimate contact with the underside of the circuit board Therefore, thermal uniformity is generally not difficult to control as long as the wave contact area along the width of the PWB s underside is uniform Since the solder is in contact with the underside of the PWB and since the underside of the PWB is coated with flux, the molten solder has the opportunity to wet to PWB lands and component leads As the process progresses, the solder wicks between the pin and barrel After leaving the wave, the board cools rapidly, liquid solder solidifies, and solder joints result 4745 Wave-Soldering Accessories Solder-wave manufacturers have devised a number of options that may be helpful to the process Some of these have extended wave-soldering capability to allow finer-pitch soldering or have permitted wave soldering of thicker PWBs.

47451 Gas Knife The gas knife more commonly called the air knife directs a highvelocity stream of heated air or nitrogen at a glancing angle to the bottom side of the board directly after the board emerges from the wave It can be effective in relieving solder bridges from tight interstitial pin fields or closely spaced passive device fields When the gas knife is used with air instead of nitrogen, increased rates of dross formation may result Also, if the angle is wrong and the velocity is too high, the exit gases could disrupt the solder wave, resulting in solder opens or shorts If it is set too cool, the knife will have little effect or may exacerbate solder bridging Since the advent of the air knife, there has been less dependence on the teardrop-shaped trailing pads used to minimize trailing edge solder bridges 4745.

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2 Sonic Assist Although not in common use, another accessory imparts highamplitude sonic pulses into the solder waveThis can help drive solder into PTHs and increase wetting, especially on thick printed wiring boards Care must be taken during setup, as very high amplitudes may pump so much solder up the barrel that it may result in topside solder bridging or solder splashing This feature can help with barrel fill on thick PWBs Its value is limited, since it does not affect board heating, which is the primary factor in barrel fill 4746 Wave-Solder Diagnostics As in all cases of mass soldering, the use of a product-specific, fully populated time-temperature profile board is necessary to ensure that critical areas of the board to be soldered are maintained at proper temperatures for each stage of the process.

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